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Gold plating×株式会社三ツ矢 - List of Manufacturers, Suppliers, Companies and Products

Gold plating Product List

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Cobalt-nickel alloy plating

Cobalt-nickel alloy plating

Improving the contact resistance and high-temperature durability of solid oxide fuel cells (SOFC)!

Cobalt-nickel alloy plating has good mechanical properties, durability, and heat resistance. [Composition ratio] Co 70wt%: Ni 30wt% each ±5wt% [Film thickness] ~3μm In examples where plating was applied to components of solid oxide fuel cells (SOFC), when used at high temperatures around 800°C, the resistance value of conventional metal components typically increases. However, by applying cobalt-nickel alloy plating compared to untreated or nickel-plated components, a lower resistance value can be maintained.

  • alloy
  • Other metal materials

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Gold-iron alloy plating

Gold-iron alloy plating

It is environmentally friendly gold plating!

By converting environmentally concerning substances such as cobalt and nickel into iron, which is a non-harmful iron group element, it can be expected to serve as an environmentally friendly alternative plating.

  • Sensors
  • others

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Gold plating / Gold alloy plating

Gold plating / Gold alloy plating

Chemically extremely stable! Excellent corrosion resistance and electrical conductivity!

"Au/Au alloy plating" is a material for electronic components that is chemically very stable and has excellent corrosion resistance and electrical conductivity. When used as an electrical contact material, a hard Au alloy plating with additives such as Co, Ni, and Fe is employed. Hard Au plating using Fe is used as an environmentally friendly hard Au plating that does not use allergenic substances. 【Features】 ■ Chemically very stable ■ Excellent corrosion resistance ■ Excellent electrical conductivity *For more details, please refer to the PDF document or feel free to contact us.

  • Other metal materials

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Tin-lead alloy plating

Tin-lead alloy plating

Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!

Gold-tin alloy plating shows a eutectic point with a composition of gold 80: tin 20, and a melting point of 280°C. 【Points】 - Gold-tin alloy plating does not expose the wafer to high temperatures during the process, preventing thermal degradation. - It allows for control of film thickness and enables thin film formation (with a proven 33% cost reduction). - The alloy ratio can be changed arbitrarily, resulting in a wide range of coating compositions (with a proven range of Au 70 to 90 wt%). - Plating on fine patterns is possible. - It has good oxidation resistance and solderability, enabling highly reliable bonding. - There are few voids and impurities, and no flux is needed, so cleaning after reflow is unnecessary. We welcome any questions or consultations. Please feel free to contact us.

  • Wafer
  • Sensors
  • alloy

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High reflectivity gold plating

High reflectivity gold plating

Successfully conducted experiments aboard the NASA Space Shuttle!

Among glossy metals, silver plating is considered to have good reflection across a wide range of wavelengths. However, silver plating tarnishes quickly in the air. To solve this problem, Mitsuya developed high-reflective gold plating. Compared to our conventional gold plating, the reflectivity has improved by 4-6%. High-reflective gold plating is widely used in various applications, such as: - Marking on wafers during semiconductor manufacturing processes - Pulse laser welding - Laser cutting machines Astronaut Koichi Wakata conducted experiments to create alloys using an imaging furnace installed on NASA's Space Shuttle. The reflective mirror of this imaging furnace uses the high-reflective gold plating developed by Mitsuya. This mirror is the most critical component for the imaging furnace.

  • Wafer
  • Other markings
  • Other metal materials

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